pasta

• High Thermal Conductivity Low Bleed Stable 
  Uses: Thermal Coupling of Electrical Device to Heatsinks 
  Thermal Conductivity: >1.829 W/m-k 
  Thermal Resistance: <0.123°C-in²/W
  20% Metal Oxide Compound 
  For CPU Cooler Use 
  N. W. 1 Gram